november 2011 doc id 17744 rev 1 1/7 7 STPS5H100-Y automotive high voltage power schottky rectifier features negligible switching losses high junction temperature capability low leakage current good trade off between leakage current and forward voltage drop avalanche specification aec-q101 qualified description this high voltage schottky barrier rectifier is packaged in dpak, and designed for high frequency miniature switched mode power supplies such as adaptators and on board dc to dc converters for automotive applications. table 1. device summary symbol value i f(av) 5 a v rrm 100 v t j (max) 175 c v f (max) 0.61 v dpak stps5h100by k nc a www.st.com
characteristics STPS5H100-Y 2/7 doc id 17744 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.51 x i f(av) + 0.02i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f(rms) forward rms current 10 a i f(av) average forward current t c = 165 c, = 0.5 5 a i fsm surge non repetitive forward current t p =10 ms sinusoidal 75 a i rrm repetitive peak reverse current t p = 2 s, f = 1 khz 1 a i rsm non repetitive peak reverse current t p = 100 s square 2 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 7200 w t stg storage temperature range -65 to + 175 c t j operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink -40 to +175 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case 2.5 c/w table 4. static electrical characteristics symbol parameter test condi tions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, < 2% reverse leakage current t j = 25 c v r = v rrm 3.5 a t j = 125 c 1.3 4.5 ma v f (2) 2. pulse test: t p = 380 s, < 2% forward voltage drop t j = 25 c i f = 5 a 0.73 v t j = 125 c 0.57 0.61 t j = 25 c i f = 10 a 0.85 t j = 125 c 0.66 0.71 dptot dtj < 1 rth(j-a)
STPS5H100-Y characteristics doc id 17744 rev 1 3/7 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 if(av) (a) pf(av)(w) = 1 = 0.5 = 0.2 = 0.1 = 0.05 t =tp/t tp 0 20 40 60 80 100 120 140 160 180 0 1 2 3 4 5 6 tamb(c) if ( av )( a ) rth(j-a)=80c/w rth(j-a)=rth(j-c) t =tp/t tp figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 p(t p ) p (1s) arm arm t (s) p 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 1 5 p(t) p (25 c) arm j arm t (c) j figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance junction to case versus pulse duration 1e-3 1e-2 1e-1 1e+0 0 10 20 30 40 50 60 70 80 90 100 110 120 t(s) im(a) tc=75c tc=50c tc=125c i m t =0.5 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-c)/rth(j-c) single pulse = 0.5 = 0.2 = 0.1 t =tp/t tp
characteristics STPS5H100-Y 4/7 doc id 17744 rev 1 figure 7. reverse leakage current versus reverse voltage applied figure 8. junction capacitance versus reverse voltage applied (typical values) 0 102030405060708090100 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 5e+3 vr(v) ir(a) tj=125c tj=25c 1 10 100 10 100 1000 vr(v) c(pf) f=1mhz tj=25c figure 9. forward voltage drop versus forward current (maximum values) figure 10. thermal resistance junction to ambient versus copper surface under tab 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 1.0 10.0 50.0 vfm(v) ifm(a) tj=25c tj=125c 0 2 4 6 8 101214161820 0 10 20 30 40 50 60 70 80 90 100 s(cu) (cm2) rth(j-a) (c/w) epoxy printed circuit board, copper thickness: 35 m
STPS5H100-Y package information doc id 17744 rev 1 5/7 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. dpak dimensions figure 12. footprint dimensions (in millimeters) ref dimensions millimeters inches min. max. min. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 h l4 g b l2 e b2 d a1 r r c a c2 0.60 min. v2 a2 6.7 6.7 3 3 1.6 1.6 2.3 2.3
ordering information STPS5H100-Y 6/7 doc id 17744 rev 1 3 ordering information 4 revision history table 5. ordering information order code marking package weight base qty delivery mode stps5h100by-tr s5h100y dpak 0.30 g 2500 tape and reel table 6. document revision history date revision changes 07-nov-2011 1 initial release.
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